Aetrium

Model 1164 - Reliability Test System _(back to IC Reliability & Test)

The Aetrium® Model 1164 Reliability Test System’s massively parallel architecture can run many tests, at many different temperatures, at the same time. It can be configured for a mix of: Copper/Aluminum Electromigration and Stress Migration, Copper ILD/Barrier BTS, Constant Voltage TDDB, SILC, MOS Hot Carrier, and NBTI. Package- and wafer-level testing are both supported. An intuitive Windows XP™ based user interface provides experiment control and data analysis capabilities.”

Modular Architecture
Packaged in small compact units called 4Paks, each 4Pak is fully self-contained with four ovens and four application modules. No external fixturing, cables or racks are used. Up to sixteen 4Paks form a complete system allowing up to 64
simultaneous experiments per system.

Massively Parallel Design
•	Test up to 4,096 capacitors for Constant Voltage TDDB and SILC TDDB as fast as a test for one single capacitor

Application Optimized Designs Utilizing multiple microprocessors in the design of each application specific module provides for fast measurements and high data throughput rates.
•	Each EM DUT has its own dedicated Source Measurements Unit (SMU) eliminating scanning operations
•	Each TDDB DUT has its own dedicated Ammeter eliminating scanning operations

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