Reliability Test
The Aetrium® Model 1164 Reliability Test System offers a single test platform that provides true parallel testing for all semiconductor reliability applications. The Test System consists of individual Application Modules each paired with an individual Notebook Oven. Application Modules operate completely autonomously from each other. The Model 1164 provides testing for the following applications:
- Electromigration (EM)
- Stress Migration (SM)
- Time Dependent Dielectric Breakdown (TDDB)
- Stress Induced Leakage Current (SILC)
- Hot Carrier Injection - MOS and Bipolar (HCI)
- Bias Temperature Instability (BTI)
Features
The Model 1164 provides a modular architecture so that customers can start with a system size that exactly matches their requirements and then easily expand as needed. The Test System can comprise of 1 to 64 Application Modules. Both Package Level Reliability and Wafer Level Reliability are supported. After completing testing, Analysis Software provides a statistical analysis tool to determine failure times based on various user defined failure conditions and graphically displays failure distributions and lifetime predictions.
Benefits
The Model 1164 Test System provides unmatched throughput and the lowest overall cost-of-test. World-class service and support protects customer investments and helps customers meet critical deadlines.
