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Please contact Aetrium directly at info@aetrium.com to receive literature and information about the specific products listed below.
Application |
Target Technologies |
| Ultra High Accuracy EM | Copper interconnects with geometries of 32nm and smaller |
| High Accuracy EM | Copper and Aluminum inteconnects with geometries less than 90nm |
| Standard EM | Copper and Aluminum interconnects with gate lengths larger than 90nm |
| High Current EM | 3-D architectures, including TSVs and Bump Technologies |
| Standard TDDB | Low-k dielectrics, barrier layers and 2-terminal gate oxide structures |
| High Voltage TDDB | Thick gate oxides and BTS testing of copper backend dielectrics and barrier layers |
| Extended Voltage TDDB | TDDB testing up to 200V |
| High Accuracy TDDB | Latest generations of high-k metal-gate, thin gate oxides and ILDs |
| Multi-terminal TDDB | Multi-terminal MOSFET structures |
| Advanced HCI | 4-terminal MOSFET structures, thin gates, ultra thin gates, high-k metal gates and bipolar technology |
| High Voltage HCI | High voltage (up to 150V) HCI testing |