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1164 Reliability Test System

Whether your needs are big or small, the 1164 Reliability Test System is right for you.  Aetrium's versatile test platform offers a large portfolio of reliability test applications in a single integrated system.  One compact Test System handles multiple simultaneous experiments, which can be the same or different application type, each at different test temperatures.  The system is easily expanded or reconfigured to meet changing requirements.  An intuitive Windows 7™ based user interface provides experiment control and data analysis capabilities.  Statistical Analysis Software provides failure analysis and lifetime predictions.

Modular Architecture

The 1164 modular architecture consists of small compact units called 4Paks.  Each 4Pak contains up to four Notebook Oven temperature chambers and four Application Modules which provide the control and source/measurement electronics. One Notebook Oven/Application Module pair create one complete independent test system.  Up to sixteen 4Paks can be contained within a single platform, allowing up to sixty four simultaneous experiments per system. 

Notebook Ovens 

The patented, solid state 1164 Notebook Ovens provide reliability, stability, small size and excellent thermal uniformity at test temperatures up to 450° C. Fans inside the 4Pak thermally isolate the Notebook Ovens so that each chamber may have a different temperature, providing unmatched test flexibility.  Each Notebook Oven may be started, stopped and reloaded at any time without affecting the others, maximizing overall system utilization and throughput. 

With each Application Module/Notebook Oven pair, users can configure their Test Systems to simultaneously run different temperatures and test types, as shown below the next section, obtaining ultimate flexibility in experiment type, temperatures, stress conditions, measurement conditions and experiment start/stop times.

Application Modules

Application modules provide accurate source/measurement electronics and test algorithm execution.  Aetrium's designs utilize a very high level of parallelism and continuous monitoring to capture detailed test results and log measurements before they can be masked by self-healing characteristics.  Each Application Module operates independently of the others and a system may be configured with multiple types of Modules to perform the following reliability tests:

• Electromigration (EM)
• Stress Migration (SM)
• Time Dependent Dielectric Breakdown (TDDB)
• Stress Induced Leakage Current (SILC)
• Hot Carrier Injection - MOS and Bipolar (HCI)
• Bias Temperature Instability (BTI)  

Test Fixturing

Aetrium offers a variety of standard and custom DUT boards to meet your exact testing requirements.   Wafer Level Adapter Kits  provide a quick and easy conversion from Package Level to high capacity Wafer Level Reliability Testing.

System Software

A Windows 7^TM PC provides experiment setup, control, monitoring, data storage and data analysis.  The System Software is extremely intuitive and easy to use for experiment setup, storing raw data that can be transferred to other platforms and graphical charting of experiment data.  All experiment data is available real time and at the end of each experiment.

Analysis Software

Analysis Software analyzes raw experiment data to determine failure times with various user specified conditions, compute shape parameters using industry models and equations and predict lifetimes at normal use conditions.

System Scalability

Each test system can be as small as a single 4Pak or as large as 16 4Paks without throughput penalty.  The same speed, accuracy and throughput exist for the largest configuration as they do for the smallest configuration.